The IPC has approved and published Test Method TM-650 2.5.5.11 on interconnect delay measurements. This method is employed by CCN-i staff to characterize printed circuits boards, check for skew in lines and line pairs, and to make a quick check on dielectric material consistency.

Download the test method for free from the IPC’s Test Method 650 Manual.

Don DeGroot of CCN-i currently chairs the subcommittee responsible for the high-frequency and high speed test methods (D24). Contact us to receive more information regarding the IPC interconnect test methods and how to participate in their formation.